Professional sample proofing
SMT-DIP plug-in processing
Professional BGA ball return
To undertake one-stop processing of OEM purchasing
产品用途:手机防盗器主板
层数:2
板材:FR-4
板厚:1.2mm
阻焊:绿油
最小线宽:0.12mm
最小孔径:0.4mm
铜厚:孔铜20um、表铜1oz
表面处理:无铅喷锡